If you have any queries, please contact us.
| HS Code | Description |
|---|---|
| 17653 | – – Other: – – – For other goods of Chapter 87 |
| 17654 | – – Other: – – – Other |
| 17655 | – Gaskets and similar joints of metal sheeting combined with other material or of two or more layers of metal |
| 17656 | – Mechanical seals |
| 17657 | – Other |
| 17658 | – – Apparatus for rapid heating of semiconductor wafers |
| 17659 | – – Spin dryers for semiconductor wafer processing |
| 17660 | – – Machines for working any material by removal of material, by laser or other light or photon beam in the production of semiconductor wafers |
| 17661 | – – Machines and apparatus for sawing monocrystal semiconductor boules into slices, or wafers into chips |
| 17662 | – – Grinding, polishing and lapping machines for processing of semiconductor wafers |
© The Ministry of Economy and Finance, Kingdom of Cambodia, All Rights Reserved., 2025.
Design and developed by Pegotec
Powered and implemented by NTR secretariat