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| Procedure Name | Description | Category | View Procedure Detail with Relevant Forms |
|---|---|---|---|
| View |
| HS Code | Description |
|---|---|
| 17673 | – – Etching and stripping equipment: – – – Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers |
| 17674 | – – Etching and stripping equipment: – – – Other |
| 17675 | – – Lithography equipment: – – – Direct write-on-wafer apparatus |
| 17676 | – – Lithography equipment: – – – Step and repeat aligners |
| 17677 | – – Lithography equipment: – – – Other |
| 17678 | – – Equipment for developing exposed wafers: – – – Dicing machines for scribing or scoring semiconductor wafers |
| 17679 | – – Equipment for developing exposed wafers: – – – Other |
| 17680 | – – Other: – – – Lasercutters for cutting contacting tracks in semiconductor production by laser beam |
| 17681 | – – Other: – – – Machines for bending, folding and straightening semiconductor leads |
| 17682 | – – Other: – – – Resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers |
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