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| HS Code | Description |
|---|---|
| 17703 | – – – Of grinding, polishing and lapping machines for processing of semiconductor wafers |
| 17704 | – – – Of apparatus for growing or pulling monocrystal semiconductor boules |
| 17705 | – – – Other |
| 17706 | – – Of machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits: – – – Of chemical vapour deposition apparatus for semiconductor production |
| 17707 | – – Of machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits: – – – Of epitaxial deposition machines for semiconductor wafers; of spinners for coating photographic emulsions on semiconductor wafers |
| 17708 | – – Of machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits: – – – Of ion implanters for doping semiconductor materials; of apparatus for physical deposition by sputtering on semiconductor wafers; of phy |
| 17709 | – – – Of spraying appliances for etching, stripping or cleaning semiconductor wafers; of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers; of dry-etching patterns on semiconductor materials: – – – – Tool holders and self-o |
| 17710 | – – – Of spraying appliances for etching, stripping or cleaning semiconductor wafers; of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers; of dry-etching patterns on semiconductor materials: – – – – Other |
| 17711 | – – – Of dicing machines for scribing or scoring semiconductor wafers; of lasercutters for cutting tracks in semiconductor production by laser beam; of machines for bending, folding and straightening semiconductor leads: – – – – Tool holders and self-open |
| 17712 | – – – Of dicing machines for scribing or scoring semiconductor wafers; of lasercutters for cutting tracks in semiconductor production by laser beam; of machines for bending, folding and straightening semiconductor leads: – – – – Other |
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