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| Procedure Name | Description | Category | View Procedure Detail with Relevant Forms |
|---|---|---|---|
| View |
| HS Code | Description |
|---|---|
| 17723 | – – Of machines or apparatus specified in Note 9 ( C ) to this Chapter: – – – Of die attach apparatus, tape automated bonders, wire bonders and of encapsulation equipment for assembly of semiconductors |
| 17724 | – – Of machines or apparatus specified in Note 9 ( C ) to this Chapter: – – – Of automated machines for the transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other materials for semiconductor devices |
| 17725 | – – Of machines or apparatus specified in Note 9 ( C ) to this Chapter: – – – Of optical stereoscopic and photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles |
| 17726 | – – Of machines or apparatus specified in Note 9 ( C ) to this Chapter: – – – Of electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles |
| 17727 | – – Of machines or apparatus specified in Note 9 ( C ) to this Chapter: – – – Of pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates, including printed circuit assemblies |
| 17728 | – – Of machines or apparatus specified in Note 9 ( C ) to this Chapter: – – – Other |
| 17729 | – Ships’ or boats’ propellers and blades therefor |
| 17730 | – Other |
| 17731 | – – – Stepper motors: – – – – Of a kind used for the goods of heading 84.15, 84.18, 84.50, 85.09 or 85.16 |
| 17732 | – – – Stepper motors: – – – – Other |
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